标准分类
标准类型
27项 国际电工委员会标准
25项 英国标准化学会标准
16项 德国标准化学会标准
16项 欧洲标准
14项 法国标准化学会标准
4项 国际标准化组织标准
3项 美国材料试验协会标准
1项 美国保险商实验室标准
1项 美国国家标准学会标准
1项 日本工业标准调查会标准
发布日期：-
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1
电绝缘半导体器件 -
- UL 1557-2011 - 中外标准 - UL- 2011/1 - 现行
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关键词：Acceptance Definitions Diode thyristor Electrical engineering Electrical insulation Electronic equipment and components Glossaries Marking Modules Production Production control Semiconductor devices Testing Thyristors Transistors
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2
半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装的外形图绘制的一般规则.小型外壳封装(SOP)的封装尺寸规格用测量方法. -
- NF C96-013-6-21-2011 - 中外标准 - NFBASE- 2011/1 - 现行
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关键词：Case drawing Components Connecting dimensions Connections Design Dimensions Drawings Electric enclosures Electrical engineering Electronic engineering Electronic equipment and components Enclosures Engineering drawings Erecting (construction operation) Grid systems Integrated circuits Marking Measurement Measuring techniques Mechanic Packages Semiconductor devices Semiconductor package Semiconductors SMD Surface mounting Surface mounting devices Symbols Types
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3
半导体装置的机械标准化.第6-20部分:表面安装的半导体器件封装外形图绘制的一般规则.小外形J-引线封装(SOJ)的封装尺寸规格测量方法. -
- NF C96-013-6-20-2011 - 中外标准 - NFBASE- 2011/1 - 现行
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关键词：Case drawing Components Connecting dimensions Connections Design Dimensions Drawings Electric enclosures Electrical engineering Electronic engineering Electronic equipment and components Enclosures Engineering drawings Erecting (construction operation) Grid systems Illustrations Integrated circuits Marking Matrices Mechanic Packages Semiconductor devices Semiconductor package Semiconductors SMD Surface mounting Surface mounting devices Symbols Types
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4
半导体器件的机械标准.第6部分:表面贴装半导体器件封装的外形图准备的一般规则. -
- NF C96-013-6-2011 - 中外标准 - NFBASE- 2011/1 - 现行
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关键词：Case drawing Definitions Design Dimensions Drawings Electric enclosures Electrical engineering Electronic engineering Electronic equipment and components Enclosures Engineering drawings Erecting (construction operation) Illustrations Integrated circuits Marking Mechanic Outline drawings Rules Semiconductor devices Semiconductor package Semiconductors SMD Standardization Surface mounting Surface mounting devices Symbols
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5
半导体装置抗机械及气候影响性能的测试方法.第19部分:晶片抗切强度. -
- NF C96-022-19/A1-2011 - 中外标准 - NFBASE- 2011/1 - 现行
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关键词：Chips Climate Climatic tests Components Electrical engineering Electrical measurement Electronic engineering Electronic equipment and components Enclosures Environmental testing Integrated circuits Mechanical testing Semiconductor devices Semiconductors Shear strength Strength of materials Testing
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6
半导体器件.机械和环境测试方法.第15部分:引脚插入式封装设备的耐钎焊温度. -
- NF C96-022-15-2011 - 中外标准 - NFBASE- 2011/1 - 现行
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关键词：Climate Climatic tests Components Electrical engineering Electrical measurement Electronic engineering Electronic equipment and components Environmental testing Integrated circuits Mechanical testing Semiconductor devices Semiconductors Soldering temperature resistance Testing Trough-hole mounting
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7
半导体器件.第1部分:金属层之间的时间相关的介质击穿(TDDB)试验. -
- NF C96-017-1-2011 - 中外标准 - NFBASE- 2011/1 - 现行
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关键词：Checking equipment Components Definitions Dielectric Dielectric breakdown Electrical engineering Electronic equipment and components Enclosures Failure Gates Heating chamber Layers Life (durability) Semiconductor devices Stress Testing Testing devices Time-dependent Voltage Voltage stress
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8
纳米技术.电感耦合等离子体质谱法测定碳纳米管样本中元素状态杂质 -
- ISO/TS 13278-2011 - 中外标准 - ISO- 2011/1 - 现行
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关键词：Carbon Carbon materials Definitions Impurities Inductive Mass spectrometry Mass spectroscopy Materials Nano tubes Nanotechnology Plasma Terminology
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9
半导体转换器.一般要求和电网整流转换器.第1-2部分:应用指南 -
- IEC/TR 60146-1-2-2011 - 中外标准 - IEC- 2011/1 - 现行
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关键词：电容性负载 电容器 扼流圈 断路器 组件 定义(术语) 效率 电力变换器 电气工程 电气安全性 电磁兼容性 电子工程 电子设备及元件 电磁兼容性(EMC) 检验 逆变器 电网换流 作标记 电力电子学 防电击 额定值 整流二极管 整流器 半导体器件 半导体二极管 半导体工程 半导体功率转换器 半导体整流器 半导体 规范(验收) 试验 半导体闸流管 变压器 晶体管 Capacitive loads Capacitors Chokes (electric) Circuit-breakers Components Definitions Efficiency Electric convertors Electrical engineering Electrical safety Electromagnetic compatibility Electronic engineering Electronic equipment and components EMC Inspection Inverters Line commutation Marking Power electronics Protection against electric shocks Ratings Rectifier diodes Rectifiers Semiconductor devices Semiconductor diodes Semiconductor engineering Semiconductor power convertors Semiconductor rectifiers Semiconductors Specification (approval) Testing Thyristors Transformers Transistors Anforderung Bauelement Begriffe Belastbarkeit Berechnung Definition Drosselspule elektromagnetische Vertr？glichkeit Elektronik elektronisches Bauelement Elektroschutz Elektrotechnik EMV Gleichrichter Gleichrichterdiode Halbleiter Halbleiterbauelement Halbleiterdiode Halbleitergleichrichter Halbleiterstromrichter Halbleitertechnik Kenndaten Kennzeichnung Kondensator Leistungselektronik Leistungsf？higkeit Leistungsschalter Netzführung Prüfung Prüfverfahren Qualit？tsprüfung Schaltung Spannung Stromrichter Thyristor Transformator Transistor Wechselrichter
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10
半导体器件.金属化应力空隙试验. -
- NF C80-204-2011 - 中外标准 - NFBASE- 2011/1 - 现行
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关键词：Aluminium Coatings Copper Electrical engineering Electronic equipment and components Metal coating Metallic surfaces Migration Reliability Resistance Semiconductor devices Stress Stress tests Test temperatures Testing
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